Electronic Technologies of Ukraine LLC provides a comprehensive range of services for assembling electronic components onto printed circuit boards, including Surface Mount Technology (SMT) and Through-Hole (DIP) assembly.
SMT Assembly (Surface Mount Technology)
SMT assembly is performed on automated production lines equipped with modern machines that ensure:
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High-precision placement of SMD components;
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Speed and reliability for serial production;
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Compatibility with various packages such as BGA, QFN, LGA, and more;
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Reflow soldering for consistent and durable joints.
We support both prototyping and full-scale production.
DIP Assembly (Dual In-line Package)
For components requiring manual or semi-automated insertion, we offer professional DIP assembly services:
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Manual placement at ESD-safe workstations with localized fume extraction;
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Wave or hand soldering based on the project’s needs;
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Visual inspection and functional testing as needed.
Our team of skilled operators ensures quality and adherence to IPC standards.
Additional Services
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Partial or full turnkey assembly, including component sourcing;
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Mixed-technology boards (SMT + THT);
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Microcontroller programming;
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Functional and final product testing.
All services are performed in compliance with our ISO 9001:2015-certified quality management system, with strict process control and flexible production scheduling.